Get current pricing for Mei, MEI-25838-ID Mei 827 Hybrid Ball Bonder Is A Simple Yet Very Efficient Semi-automatic Bonder For Thermosonic Or Thermocompression Bonding. Unique Gravity Fed/d . Product Category: Semiconductor, Sub Category: Bonders:

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Manufacturer: Mei Part number: MEI-25838-ID Description: Mei 827 Hybrid Ball Bonder Is A Simple Yet Very Efficient Semi-automatic Bonder For Thermosonic Or Thermocompression Bonding. Unique Gravity Fed/d . Product Category: Semiconductor, Sub Category: Bonders

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Manufacturer: Mei Part number: MEI-25838-ID Description: Mei 827 Hybrid Ball Bonder Is A Simple Yet Very Efficient Semi-automatic Bonder For Thermosonic Or Thermocompression Bonding. Unique Gravity Fed/d . Product Category: Semiconductor, Sub Category: Bonders