Get current pricing for Surface Technology System, Multiplex RIE System Manually Loaded Load-lock Batch Plasma Etch System. Wafer Platen Can Accommodate A Variety Of Substrate Sizes From 75 Mm Up To 200 Mm. Process . Product Category: Semiconductor, Sub Category: Lab Equipment:

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Manufacturer: Surface Technology System Part number: Multiplex RIE System Description: Manually Loaded Load-lock Batch Plasma Etch System. Wafer Platen Can Accommodate A Variety Of Substrate Sizes From 75 Mm Up To 200 Mm. Process . Product Category: Semiconductor, Sub Category: Lab Equipment

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Manufacturer: Surface Technology System Part number: Multiplex RIE System Description: Manually Loaded Load-lock Batch Plasma Etch System. Wafer Platen Can Accommodate A Variety Of Substrate Sizes From 75 Mm Up To 200 Mm. Process . Product Category: Semiconductor, Sub Category: Lab Equipment