Get current pricing for Hypervision, CHIP UNZIP Backside Preparation System. Low Stress Backside Preparation System Is Useful For The Development And Analysis Of Flip-chips, Lead-on-chips Packaging . Product Category: Semiconductor, Sub Category: Lab Equipment:

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Manufacturer: Hypervision Part number: CHIP UNZIP Description: Backside Preparation System. Low Stress Backside Preparation System Is Useful For The Development And Analysis Of Flip-chips, Lead-on-chips Packaging . Product Category: Semiconductor, Sub Category: Lab Equipment

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Manufacturer: Hypervision Part number: CHIP UNZIP Description: Backside Preparation System. Low Stress Backside Preparation System Is Useful For The Development And Analysis Of Flip-chips, Lead-on-chips Packaging . Product Category: Semiconductor, Sub Category: Lab Equipment