Get current pricing for Micro Join, B21CKFPASA0B000 Heat Seal Bonding System. Uses A Pulsed Heated Bar To Perform Bonding Of Heat Seal Connectors To Lcd, Pcb Or Other Substrates. Bonding Cycle Is Contro . Product Category: Semiconductor, Sub Category::

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Manufacturer: Micro Join Part number: B21CKFPASA0B000 Description: Heat Seal Bonding System. Uses A Pulsed Heated Bar To Perform Bonding Of Heat Seal Connectors To Lcd, Pcb Or Other Substrates. Bonding Cycle Is Contro . Product Category: Semiconductor, Sub Category:

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Manufacturer: Micro Join Part number: B21CKFPASA0B000 Description: Heat Seal Bonding System. Uses A Pulsed Heated Bar To Perform Bonding Of Heat Seal Connectors To Lcd, Pcb Or Other Substrates. Bonding Cycle Is Contro . Product Category: Semiconductor, Sub Category: